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Turn a stackup, a laminate and a data rate into insertion loss over the run, the share each loss mechanism takes, and the longest length the budget allows.
The short answer
Insertion loss is the attenuation a signal suffers along a trace, measured in decibels at a stated frequency. It has two causes that scale differently: dielectric loss rises in proportion to frequency and follows the laminate's loss tangent, while conductor loss rises with the square root of frequency through skin depth and is multiplied by copper roughness. At 8 GHz on 0.2 mm FR-4 a typical 0.35 mm microstrip loses roughly 0.15 dB per inch, and a low-loss laminate removes much of the dielectric part.
Calculator
Enter the cross-section, the laminate and the frequency the channel is judged at — normally the Nyquist rate, half the data rate. The tool returns attenuation per inch, the total over the run, the split between dielectric, strip and return path, and the longest length the budget buys. The models are the ones behind the impedance calculator, so the loss here is the loss that calculator's panel reports.
A laminate fills Dk, Df and foil roughness together.
Cross-section and material
Channel
Judge the channel at its Nyquist rate: half the data rate. 16 GT/s is 8 GHz; 32 GT/s is 16 GHz.
Insertion loss against the budget
Dielectric and conductor loss separated, with the length the budget allows.
6.42 dB against a 6.0 dB budget.
107% of the budget.
The length the whole budget buys.
Where the loss goes
| Term | dB/in | Share |
|---|---|---|
| Dielectric | 0.442 | 54% |
| Strip (roughened) | 0.255 | 31% |
| Return path | 0.119 | 15% |
| Roughness | 1.76× | skin depth 0.74 µm |
What the budget leaves out
Free, no account. The engineer reviews the inputs before a fixed quote is issued.
Want the derivation? Jump to the math behind the calculator.
The math
Each equation is rendered with KaTeX, which also emits a MathML twin for screen readers and answer engines, explained in plain language, and copyable as LaTeX from the button in its corner. The variable list says what every symbol means; the model-limit note says where the formula stops being trustworthy.
Loss is linear in length, so a budget turns directly into the longest run it allows.
Attenuation per unit length is a property of the cross-section; length is the only thing routing changes. That is why the same 0.15 dB per inch is fine at 200 mm and fatal at 800 mm.
The tool inverts the relation to report the longest length that still fits a budget, which is the number a router can act on.
Model limits
This counts the trace only. Two vias, the connector and the package each add their own loss, and on a short channel those can exceed the trace.
Dielectric loss grows linearly with frequency and with the laminate's loss tangent.
The square root of the effective permittivity is how much the field is slowed; pi f over c turns that into a phase constant; the loss tangent is the fraction lost per radian.
The filling factor q is (εeff − 1)/(εr − 1): the part of the field that is in air has no dielectric loss, and a stripline buries all of its field so q is 1.
Model limits
Loss tangent is itself frequency dependent, and the calculator evaluates a causal wideband model anchored at the datasheet frequency rather than holding Df constant.
Conductor loss rises with the square root of frequency, and roughness multiplies it.
Surface resistance is copper resistivity over skin depth, so it grows with the square root of frequency. The two reciprocal widths are the strip and the return path: both carry current and both dissipate.
The roughness factor is Hammerstad's multiplier, 1 + (2/pi) arctan(1.4 (Δ/δ)²). When the foil roughness equals the skin depth it is already 1.64, which is why rough copper costs 30–50% at 10 GHz.
Model limits
The return-path width is approximated as w + 2h for microstrip and w + b for stripline. A split plane or a thin neck is worse than this model says.
The depth the current occupies falls as the square root of frequency, which is why conductor loss grows that way.
At 1 GHz the skin depth in copper is about 2 µm; at 10 GHz it is about 0.66 µm. Once it is smaller than the foil's surface roughness the current has to follow the profile, and the effective resistance stops falling as fast.
The tool reports the skin depth at the evaluation frequency next to the roughness multiplier, so the two can be compared directly.
Model limits
The formula assumes a smooth good conductor. Above roughly 10 GHz roughness dominates and the smooth-copper depth overstates how much metal carries current.
Theory
Dielectric loss comes from the laminate's loss tangent: the field does work on the resin as it oscillates and the energy leaves as heat. It rises linearly with frequency, so it dominates a long channel at a high rate and it is the one term a better laminate actually fixes.
Conductor loss comes from the copper's surface resistance. At a few gigahertz the skin depth is below a micrometre, so the current runs in the surface profile of the foil: rough copper lengthens the path and adds loss. It rises with the square root of frequency, which is why the two terms swap dominance as the rate climbs.
Budget
A link closes when what the transmitter, the channel and the receiver can tolerate adds up to less than the margin the standard provides. The receiver's equalisation buys back a fixed amount, the connectors and vias spend some, and the trace gets the remainder. The tool calls 80% of the budget tight because two vias, a connector and a package are not in this number.
Length is the only input a layout can still change after the stackup is frozen, which is why the answer is a length as well as a loss. If the run exceeds the budget, the options are a better laminate, a wider trace on a thicker dielectric, or a different route.
When the channel has margin the closed form is enough. When it does not, the loss has to come from an extraction on the actual stackup; that is the SI/PI verification service engagement.
FAQ
Send the stackup and interface list. We will check the loss budget against the real layout before the quote is fixed.